芯片互连用粒径双峰分布纳米铜膏的低温无压烧结纳连接机理和接头可靠性
黄海军, 周敏波, 吴雪, 张新平
Nano-joining Mechanisms and Joint Reliability of Die Attachment Using Bimodal-sized Cu Nanoparticle Paste Capable of Low-temperature Pressureless Sintering
HUANG Haijun, ZHOU Minbo, WU Xue, ZHANG Xinping
机械工程学报
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2022, (2): 58
-65
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DOI: 10.3901/JME.2022.02.058
