纳米压痕研究石墨烯增强Sn-Ag-Cu钎料焊点的高温蠕变行为
李元, 徐连勇, 高宇, 荆洪阳, 赵雷, 韩永典
High Temperature Creep Behavior of Sn-Ag-Cu Solder Joints Reinforced by Graphene via Nanoindentation
LI Yuan, XU Lianyong, GAO Yu, JING Hongyang, ZHAO Lei, HAN Yongdian
机械工程学报
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2022, (2): 50
-57
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DOI: 10.3901/JME.2022.02.050
