不同圆角半径金刚石划擦单晶SiC过程中的材料去除机理研究
段念, 黄身桂, 于怡青, 黄辉, 徐西鹏
The Material Removal Mechanism of Monocrystal SiC Scratching by Single Diamond Grit with Different Tip Radius
DUAN Nian, HUANG Shengui, YU Yiqing, HUANG Hui, XU Xipeng
机械工程学报
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2017, (15): 171
-180
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DOI: 10.3901/JME.2017.15.171
