面向电子封装装备制造的若干关键技术研究及应用*
陈新, 姜永军, 谭宇韬, 高健, 杨志军, 刘冠峰, 贺云波, 王晗, 李泽湘
Progress and Application of Key Technologies on the Electronic Packaging Equipment Development
CHEN Xin, JIANG Yongjun, TAN Yutao, GAO Jian, YANG Zhijun, LIU Guanfeng, HE Yunbo, WANG Han, LI Zexiang
机械工程学报
.
2017, (5): 181
-189
.
DOI: 10.3901/JME.2017.05.181
