高温高湿环境对键合Cu线可靠性影响的研究

doi:10.3901/JME.2016.06.086

机械工程学报 ›› 2016, Vol. 52 ›› Issue (6): 86-91.doi: 10.3901/JME.2016.06.086

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高温高湿环境对键合Cu线可靠性影响的研究

曹军¹, 范俊玲², 尚显光¹, 刘志强¹

1. 河南理工大学机械与动力工程学院焦作 454000;
2. 焦作大学化工与环境工程学院焦作 454000

出版日期:2016-03-15 发布日期:2016-03-15
作者简介:曹军(通信作者),男,1979年出生,博士。主要研究方向为微电子封装。E-mail：cavan@hpu.edu.cn
基金资助:
河南理工大学博士基金资助项目(60407/004)

Bond Reliability under High Temperature and Humid Environment for Copper Bonding Wire

CAO Jun¹, FAN Junling², SHANG Xianguang¹, LIU Zhiqiang¹

1. School of Mechanical and Power Engineering, Henan Polytechnic University, Jiaozuo 454000;
2. Chemical and Environmental Engineering, Jiaozuo University, Jiaozuo 454000

Online:2016-03-15 Published:2016-03-15

摘要/Abstract

摘要： 通过高温存储试验和高压蒸煮试验对铜线键合器件在高温高湿环境下的可靠性进行研究,分析试验前后键合球剪切力和键合球拉力的变化,利用扫描电镜、透射电镜观察试验前后键合界面形貌及金属间化合物类型,采用能谱仪对试验前后键合界面的成分进行分析。研究结果表明,键合初期,Cu/Al键合界面没有生成Cu、Al金属间化合物,键合界面具有一定的连接强度;高温存储试验后,Cu/Al键合界面生成CuAl、Cu₉Al₄金属间化合物,连接强度增加;高压蒸煮试验后,Cu/Al键合界面的Cu₉Al₄金属间化合物消失,键合界面由于卤素原子的加入使周围环境呈现弱酸性,Cu₉Al₄金属间化合物在该环境下被腐蚀,其反应式为,键合界面出现孔洞,键合界面强度减小,降低了器件的可靠性。

关键词: 键合强度, 键合铜线, 金属间化合物, 可靠性

Abstract: The copper wire bonding devices are investigated by high temperature storage(HTS) and pressure cooking test(PCT), and the ball shear strength and ball pull strength are analyzed of before experiments and finished experiments. Scanning electron microscope(SEM) and transmission electron microscope(TEM) are used to identify the bonding interface photography and intermetallic compounds, the bonding interface compositions are analyzed by energy dispersive spectrometer(EDS). The results show that the Cu and Al intermetallic compounds are not found on Cu/Al bonding interface, the ball shear strength and ball pull strength are high for bonding interface before HTS and PCT test. After HTS, the CuAl and Cu₉Al₄ intermetallic compounds are found on Cu/Al bonding interface, and the ball shear strength and ball pull strength are increased because of the CuAl and Cu₉Al₄ intermetallic compounds. After PCT, the ball shear strength and ball pull strength decrease excessively and some voids are found on Cu/Al bonding interface, the Cu₉Al₄ intermetallic compounds disappeared. The environment around Cu/Al interface is weak acid due to halogen atoms, Cu₉Al₄ intermetallic compounds corroded in weak acid environment, the reaction equation is , and the reliability of the device decreases.

Key words: bonding strength, Cu bonding wire, intermetallic compounds, reliability

中图分类号:

TG249

曹军, 范俊玲, 尚显光, 刘志强. 高温高湿环境对键合Cu线可靠性影响的研究[J]. 机械工程学报, 2016, 52(6): 86-91.

CAO Jun, FAN Junling, SHANG Xianguang, LIU Zhiqiang. Bond Reliability under High Temperature and Humid Environment for Copper Bonding Wire[J]. Journal of Mechanical Engineering, 2016, 52(6): 86-91.

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高温高湿环境对键合Cu线可靠性影响的研究

Bond Reliability under High Temperature and Humid Environment for Copper Bonding Wire

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