• CN:11-2187/TH
  • ISSN:0577-6686

机械工程学报 ›› 2022, Vol. 58 ›› Issue (16): 100-109.doi: 10.3901/JME.2022.16.100

• 特邀专栏: 高性能塑性成形制造(上) • 上一篇    下一篇

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退火处理对镁/铝合金厚向结合板界面结构及镁侧组织的影响

于涛1, 李峰1,2, 高磊1, 杜华秋1, 王野1   

  1. 1. 哈尔滨理工大学材料科学与化学工程学院 哈尔滨 150040;
    2. 哈尔滨理工大学先进制造智能化技术教育部重点实验室 哈尔滨 150080
  • 收稿日期:2021-11-29 修回日期:2022-04-15 出版日期:2022-08-20 发布日期:2022-11-03
  • 通讯作者: 李峰(通信作者),男,1978年出生,博士,教授,博士研究生导师。主要研究方向为特种塑性成形、轻量化成形等。E-mail:fli@hrbust.edu.cn
  • 作者简介:于涛,男,1995年出生。主要研究方向为轻合金特种挤压成形技术。E-mail:yutao_8617@126.com
  • 基金资助:
    国家自然科学基金资助项目(51675143)

Effect of Annealing Treatment on the Inter-facial Structure and Magnesium Side Microstructure of Mg/Al Alloy Thick-directional Bonded Plate

YU Tao1, LI Feng1,2, GAO Lei1, DU Huaqiu1, WANG Ye1   

  1. 1. School of Materials Science and Chemical Engineering, Harbin University of Science and Technology, Harbin 150040;
    2. Key Laboratory of Advanced Manufacturing and Intelligent Technology, Ministry of Education, Harbin University of Science and Technology, Harbin 150080
  • Received:2021-11-29 Revised:2022-04-15 Online:2022-08-20 Published:2022-11-03

摘要: 退火处理对异质连接构件的界面结构及组织均有重要影响,决定着连接强度及性能。研究利用挤压法成形的镁/铝合金厚向结合板的退火工艺,研究结果表明,退火处理使过渡层由单层转变为双层结构,由γ-Al12Mg17亚层和β-Al3Mg2亚层所组成。退火温度为250 ℃,过渡层随时间延长由20 μm平缓增长到30 μm,镁侧基体晶粒尺寸一直增大至11.73 μm;退火时间为1 h,过渡层随温度增加由15 μm激增长到45 μm;镁侧基体组织晶粒尺寸则呈现先减小后增大的生成趋势。而且,低温短时退火会使界面结合强度有所增加,约达60 MPa,但随着退火温度的增加和退火时间的延长,界面结合强度和显微硬度均有所下降,为高性能镁/铝合金厚向结合板挤压成形制造提供了理论基础和科学指导。

关键词: 厚向结合板, 挤压, 退火处理, 界面结构, 微观组织

Abstract: Annealing has an important influence on the interface microstructure of heterogeneous connecting components, and determines the strength and performance of the connection. The annealing process of magnesium/aluminum alloy thick-to-board bonded plates formed by extrusion is studied. The results show that the annealing treatment transforms the transition layer from a single layer to a double layer structure, which are made up of γ-Al12Mg17 sub-layer and β-Al3Mg2. The annealing temperature is 250 ℃, the transition layer width grows gently from 20μm to 30 μm with time, and the grain size of the magnesium side matrix increases to 11.73 μm. When annealing time is 1 h, the transition layer width increases from 15 μm to 45 μm as the temperature increases; The grain size of the magnesium side matrix structure shows a trend of decreasing at and then increasing. Moreover, low-temperature and short-time annealing will increase the interface bonding strength, up to about 60 MPa. But with the increase of annealing temperature and time, the interface bonding strength and micro-hardness decreased, it provides a theoretical basis and scientific guidance for the extrusion and manufacturing of high-performance magnesium/aluminum alloy thick-direction bonded plates.

Key words: thick to combine board, extrusion, annealing, interface structure, micro-structure

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