电子封装用低银Sn-0.3Ag-0.7Cu钎料研究进展

doi:10.3901/JME.2022.12.039

机械工程学报 ›› 2022, Vol. 58 ›› Issue (12): 39-54.doi: 10.3901/JME.2022.12.039

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电子封装用低银Sn-0.3Ag-0.7Cu钎料研究进展

孔祥霞^1,2, 翟军军³, 孙凤莲²

1. 北华航天工业学院材料工程学院廊坊 065000;
2. 哈尔滨理工大学材料科学与化学工程学院哈尔滨 150040;
3. 北华航天工业学院航空宇航学院廊坊 065000

收稿日期:2021-07-07 修回日期:2022-04-01 出版日期:2022-06-20 发布日期:2022-09-14
通讯作者: 孔祥霞(通信作者),女,1989年出生,博士,讲师。主要研究方向为微电子封装焊点可靠性。E-mail:xiangxia0502@163.com
作者简介:孙凤莲,女,1957年出生,博士,教授,博士研究生导师。主要研究方向为绿色电子组装技术及可靠性。E-mail:sunfengl@hrbust.edu.cn
基金资助:
国家自然科学基金（12002003）、河北省高等学校科学技术研究重点（ZD2020131）、河北省自然科学基金（E2021409021）、廊坊市青年拔尖人才（LFBJ202001）、廊坊市科技支撑计划（2019011046）和北华航天工业学院博士科研启动（BKY201811）资助项目

Research Progress of Low-Silver Sn-0.3Ag-0.7Cu Solder for Electronic Packaging

KONG Xiangxia^1,2, ZHAI Junjun³, SUN Fenglian²

1. Department of Material Engineering, North China Institute of Aerospace Engineering, Langfang 065000;
2. School of Material Science and Chemical Engineering, Harbin University of Science and Technology, Harbin 150040;
3. Department of Aeronautics and Astronautics, North China Institute of Aerospace Engineering, Langfang 065000

Received:2021-07-07 Revised:2022-04-01 Online:2022-06-20 Published:2022-09-14

摘要/Abstract

摘要： 随着电子封装无铅化、高集成度需求的不断提升，开发低成本、高性能的无铅封装材料对传统含铅材料进行有效替代已成为全球关注的热点。目前所开发的Sn-Ag-Cu系无铅钎料中含银量最低的Sn-0.3Ag-0.7Cu (SAC0307)钎料具有较好的延展性、抗冲击跌落性能且成本低等优点，但也存在熔点高，力学性能和抗热疲劳性能低等问题导致其可靠性降低。为进一步促进电子封装用低银SAC0307钎料的发展，改善其力学性能和可靠性，新型低银SAC0307复合钎料的研究成为重要研究方向之一。简述近十年来国内外低银SAC0307复合钎料的研究现状，着重从添加合金元素、金属纳米颗粒、金属氧化物颗粒、碳纳米颗粒及其他非金属材料方面回顾总结了低银SAC0307钎料改性工作方面的研究成果，以期为后续研发高性能的新型低银SAC0307复合钎料提供一定的帮助。

关键词: Sn-0.3Ag-0.7Cu, 合金元素, 纳米颗粒, 金属间化合物, 力学性能

Abstract: With the increasing demand for lead-free and high integration of electronic packaging, the development of low-cost and high-performance lead-free packaging materials to effectively replace the traditional lead-containing materials has become a global focus. The Sn-0.3Ag-0.7Cu (SAC0307) solder with the lowest silver content in the currently developed Sn-Ag-Cu lead-free solder has the advantages of good ductility, impact drop resistance and low cost, but its reliability is reduced due to its high melting point, low mechanical properties and low thermal fatigue resistance. In order to further promote the development of low-silver SAC0307 solder for electronic packaging and improve its mechanical properties and reliability, the research of new low-silver SAC0307 composite solder has become one of the important research directions. The research status of SAC0307 composite solder with low silver content in recent ten years is elaborated. The research results on the modification of low-silver SAC0307 solder are reviewed and summarized from the aspects of adding alloy elements, metal nanoparticles, metal oxide particles, carbon nanoparticles and other non-metallic materials. It is expected to provide some help for the subsequent research and development of high-performance new low-silver SAC0307 composite solder.

Key words: Sn-0.3Ag-0.7Cu, alloy element, nanoparticles, intermetallic compound, mechanical properties

中图分类号:

TG425

孔祥霞, 翟军军, 孙凤莲. 电子封装用低银Sn-0.3Ag-0.7Cu钎料研究进展[J]. 机械工程学报, 2022, 58(12): 39-54.

KONG Xiangxia, ZHAI Junjun, SUN Fenglian. Research Progress of Low-Silver Sn-0.3Ag-0.7Cu Solder for Electronic Packaging[J]. Journal of Mechanical Engineering, 2022, 58(12): 39-54.

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电子封装用低银Sn-0.3Ag-0.7Cu钎料研究进展

Research Progress of Low-Silver Sn-0.3Ag-0.7Cu Solder for Electronic Packaging

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