• CN: 11-2187/TH
  • ISSN: 0577-6686
Study of Size Effects on the Dynamic Resistance Variation and Microstructure Evolution of BGA Solder Joints During Electromigration
WANG Wei, FENG Jiayun, WANG Shuai, WANG Taohan, TIAN Ruyu, TIAN Yanhong
Journal of Mechanical Engineering . 2026, (4): 126 -134 .  DOI: 10.3901/JME.260111

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