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CN: 11-2187/TH
ISSN: 0577-6686
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JME College
中文
Research on Fatigue Properties of Micron Scale Copper Bonding Wires
ZHAO Shuang, ZHAO Zihua, LEI Ming, YE Heng, QI Fengcai
Journal of Mechanical Engineering . 2016, (
18
): 70 -76 . DOI: 10.3901/JME.2016.18.070
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