• CN: 11-2187/TH
  • ISSN: 0577-6686

Journal of Mechanical Engineering ›› 2025, Vol. 61 ›› Issue (19): 327-340.doi: 10.3901/JME.2025.19.327

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Investigation of the Mechanism in Ultrasonic Elliptical Vibration Diamond Cutting of Mo-La Alloy

LIU Liang1,2, WANG Mao1,2, MA Shanyi1,2, FU Yufan1,2, ZHANG Jianguo1,2, XIAO Junfeng1,2, CHEN Xiao3,4, XU Jianfeng1,2   

  1. 1. School of Mechanical Science and Engineering, Huazhong University of Science and Technology, Wuhan 430074;
    2. State Key Laboratory of Intelligent Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan 430074;
    3. School of Mechanical Engineering, Hubei University of Technology, Wuhan 430068;
    4. National Innovation Institute of Digital Design and Manufacturing, Wuhan 430206
  • Received:2024-10-18 Revised:2025-07-26 Published:2025-11-24

Abstract: Mo-La alloy is a typical difficult-to-cut material, which is very prone to cause brittle fracture and tool wear in the conventional cutting process, making it difficult to obtain high-quality machined surfaces. Ultrasonic elliptical vibration cutting technology is an effective method for achieving ultra-precision cutting of difficult-to-cut materials. This research conducts diamond cutting experiments on Mo-La alloy to verify the enhancement effect of elliptical vibration cutting on material machinability and comparatively analyzes the surface generation mechanism, chip formation mechanism, and tool damage mechanism of Mo-La alloy in conventional cutting and ultrasonic elliptical vibration cutting. By changing the elliptical vibration trajectory of the tool, a maximum critical depth of cut of 10351.9 nm is achieved at an orientation angle of elliptical trajectory of 160°, which is 197 times higher than that of 52.5 nm in conventional cutting. In the conventional diamond cutting process, the material is removed mainly in a brittle mode. The scaly burr defects are generated on the forming surface. The serration feature of the chip shear band is obvious and the contact surface between the chip and the tool is rough with obvious tearing. At the same time, the material is severely adhered to the tool. In the ultrasonic elliptical vibration diamond cutting process, the material is removed mainly in the brittle mode. The generation of scaly burr defects on the forming surface is significantly suppressed. The serration feature of the chip shear band is weakened and the contact surface between the chip and the tool is smooth with no tearing phenomenon. The material adhesion on the tool is effectively suppressed. It is dictated that ultrasonic elliptical vibration cutting significantly enhances the machinability of Mo-La alloy, and inhibits surface brittle defects and tool damage. This research reveals the material removal mechanism of Mo-La alloy, which can help to promote the application of Mo-La alloy in aerospace and other fields.

Key words: Mo-La alloy, difficult-to-cut material, ultrasonic elliptical vibration cutting, ductile-to-brittle transition, material removal mechanism

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