Recent Development and Prospective of Double-sided Lapping Technology

doi:10.3901/JME.2024.07.266

Abstract

Abstract: In recent years, semiconductor and optical manufacturing fields have experienced rapid development, leading to a heightened demand for thin flat components, such as wafers, optical windows, and sealing rings. Consequently, the quality requirements for their processing have become increasingly rigorous. Double-sided lapping is a widely used method for processing thin flat components, due to its low processing stress and high efficiency. To provide a comprehensive review of the current status of double-sided lapping, this study focuses on examining the mechanisms, processes, applications, and recent research developments in equipment. Additionally, the optimization effects of theoretical models on the double-sided lapping process are analyzed, and the current application status is summarized. Moreover, this study thoroughly compares the advantages and disadvantages of representative double-sided lapping equipment from various manufacturers in the industry, highlighting the gap between domestic and international equipment. The findings of this analysis offer a valuable reference for future research in the field and present a projection of the development trends of double-sided lapping technology.

Key words: double-sided lapping process, material removal, process optimization, double-sided lapping equipment

CLC Number:

TH166

GUO Jiang, PAN Bo, LIAN Jiale, YANG Zhe, LIU Huan, GAO Fei, KANG Renke. Recent Development and Prospective of Double-sided Lapping Technology[J]. Journal of Mechanical Engineering, 2024, 60(7): 266-288.

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