• CN: 11-2187/TH
  • ISSN: 0577-6686

›› 2009, Vol. 45 ›› Issue (1): 218-222.

• Article • Previous Articles     Next Articles

Direct Chip Attachment Packaging of a 2-D Thermal Flow Sensor

SHEN Guangping;ZHANG Hua;WU Jian;QIN Ming;HUANG Qingan   

  1. Key Laboratory of MEMS of Ministry of Education, Southeast University
  • Published:2009-01-15

Abstract: The design, fabrication and test of a direct chip attach packaged thermal flow sensor is given. The circular structure sensor measures the 2-D wind speed and direction by using calorimetric principle. The calorimetric flow sensor is fabricated by using two-step metal lift-off process on a ceramic slice. Then the KGD is glued to the backside of PCB board with package resin, and wire is bonded to the front side of PCB through a prefabricated hole. Finally, the chip is capsulated using thermal insulated package resin on the front side. The wind tunnel test of the packaged sensor chip is carried out. The sensor can detect 360° wind direction in a wind speed range of 6 m/s.

Key words: Direct chip attach, MEMS package, Wind direction sensor, Wind speed sensor

CLC Number: