Abstract: The rapid increase of heat generation level has become a major technical challenge in the development and applications of contemporary advanced microelectronic chip system. In recent years, heat transfer experiments and theoretical analysis of phase change micro-channels have confirmed its high heat flux transfer characteristics, suggesting the great prospects of this technology in advanced micro-system cooling applications in the field of electronic communications, aerospace and other industries. The latest advances in the three main areas of phase change heat transfer micro-channel research micro-thermal fluid dynamics and heat transfer mechanism in micro-channel, the relationship between micro-channel structure and its heat transfer characteristics, and micro-channel structure (devices) manufacturing technology are summarized. Related theories and methods are discussed. And finally, the development trend and prospects of this technology are also analyzed.

Key words: Heat dissipation, Design and manufacturing, Micro-channel