Influence of Stress-free Temperature and Model Simplification in Life Evaluation of CCGA Packages

doi:10.3901/JME.2024.12.268

Abstract

Abstract: Finite element analysis can be used to evaluate the thermal cycle fatigue life of ceramic column grid array (CCGA) packages, there are different opinions on the value of stress-free temperature and model simplification methods in relevant researches at home and abroad. Finite element analysis and Darveaux model are used to calculate the thermal cycle fatigue life of chosen CCGA package with different stress-free temperature and model simplification methods. The results show that the difference in the fatigue life calculation results is less than 0.1% when stress-free temperature equal to room temperature and the maximum temperature in thermal cycle test. Thermal cycle fatigue life is slightly underestimated when stress-free temperature equal to solder solidification temperature. Similar fatigue life calculation results can be obtained by omitting plating and copper foil, omitting part of printed circuit board, slice model and sub-model. The slice model performs best in reducing the amount of computer calculation. The number of model grid elements is reduced by 95% using slice model compared with initial model, and the deviation of the fatigue life calculation result is less than 10%.

Key words: CCGA package, finite element analysis, fatigue life, stress-free temperature, model simplification

CLC Number:

TG156

FENG Mingxiang, JIANG Qinglei, WANG Xuyan. Influence of Stress-free Temperature and Model Simplification in Life Evaluation of CCGA Packages[J]. Journal of Mechanical Engineering, 2024, 60(12): 268-276.

References

[1] 王惠，官岩，陈灏. CCGA封装焊点热疲劳寿命分析[J]. 质量与可靠性，2020(4)：31-38. WANG Hui，GUAN Yan，CHEN Hao. Thermal fatigue life analysis of CCGA package solder joints[J]. Quality and Reliability，2020(4)：31-38.
[2] 高丽茵，李财富，刘志权，等. 先进电子封装中焊点可靠性的研究进展[J]. 机械工程学报，2022，58(2)：185-202. GAO Liyin，LI Caifu，LIU Zhiquan，et al. Research progress on the reliability of solder joint for advanced microelectronic packaging[J]. Journal of Mechanical Engineering，2022，58(2)：185-202.
[3] 陈志文，梅云辉，刘胜，等. 电子封装可靠性：过去、现在及未来[J]. 机械工程学报，2021，57(16)：248-268. CHEN Zhiwen，MEI Yunhui，LIU Sheng，et al. Reliability in electronic packaging：Past, now and future[J]. Journal of Mechanical Engineering，2021，57(16)：248-268.
[4] JOHN L，WALTER D. Reliability of an 1657CCGA (ceramic column grid array) package with 95.5Sn3.9Ag0.6Cu lead-free solder paste on PCBs (printed circuit boards)[J]. Journal of Electronic Packaging，2005，127(2)：96-105.
[5] 李胜利，牛飘，杭春进，等. 极端温度环境Sn基焊点本构方程的研究进展[J]. 机械工程学报，2022，58(2)：236-245. LI Shengli，NIU Piao，HANG Chunjin，et al. Research progresses on reliability of Sn-based solder joints in extreme temperature environment[J]. Journal of Mechanical Engineering，2022，58(2)：236-245.
[6] BABER F，GUVEN I. Solder joint fatigue life prediction of electronic packages using combined FEA and peridynamics[C]//2016 IEEE 66th Electronic Components and Technology Conference. Las Vegas：IEEE，2016，225-231.
[7] REDDY V V B，GUPTA S，WILLIAMSON J，et al. Correlation studies between laser ultrasonic inspection data and finite-element modeling results in evaluation of solder joint quality in microelectronic packages[J]. Journal of Electronic Packaging，2021，144(1)：011009.
[8] 撒子成，王尚，冯佳运，等. SiP器件组装焊点形态预测及其随机振动可靠性仿真研究[J]. 机械工程学报，2022，58(2)：276-283. SA Zicheng，WANG Shang，FENG Jiayun，et al. Simulation of SiP solder joint geometry and random vibration reliability prediction[J]. Journal of Mechanical Engineering，2022，58(2)：276-283.
[9] 张玉财，涂善东，罗云，等. 钎焊接头的蠕变损伤与寿命预测[J]. 机械工程学报，2021，57(16)：218-234，247. ZHANG Yucai，TU Shantung，LUO Yun，et al. Investigation the creep damage and life prediction of the brazed joint[J]. Journal of Mechanical Engineering，2021，57(16)：218-234，247.
[10] 孙国芹，尚德广，王杨. 金属多轴疲劳行为与寿命预测研究进展[J]. 机械工程学报，2021，57(16)：153-172. SUN Guoqin，SHANG Deguang，WANG Yang. Research progress on fatigue behavior and life prediction under multiaxial loading for metals[J]. Journal of Mechanical Engineering，2021，57(16)：153-172.
[11] 王康康，王小威，温建锋，等. 蠕变断裂：从物理失效机制到结构寿命预测[J]. 机械工程学报，2021，57(16)：132-152. WANG Kangkang，WANG Xiaowei，WEN Jianfeng，et al. Creep rupture：From physical failure mechanisms to lifetime prediction of structures[J]. Journal of Mechanical Engineering，2021，57(16)：132-152.
[12] 董星，刘雨庆，段雄. 前混合水射流多弹丸喷丸模型及残余应力场的数值模拟[J]. 机械工程学报，2020，56(4)：224-232. DONG Xing，LIU Yuqing，DUAN Xiong. Numerical simulation of multi-shot shot peening models and residual stress field of premixed water jet[J]. Journal of Mechanical Engineering，2020，56(4)：224-232.
[13] 赵丙峰，谢里阳，李冲，等. 构件不同部位粗糙度对疲劳性能影响差异分析[J]. 机械工程学报，2020，56(2)：43-55. ZHAO Bingfeng，XIE Liyang，LI Chong，et al. Analysis on the different effect of roughness in different part of structure on fatigue property[J]. Journal of Mechanical Engineering，2020，56(2)：43-55.
[14] FAN X J，VARIA B，HAN Q. Design and optimization of thermo-mechanical reliability in wafer level packaging [J]. Microelectronics Reliability，2010，50(4)：536-546.
[15] GUSTAFSSON G，GUVEN I，KRADINOV V，et al. Finite element modeling of BGA packages for life prediction[C]//2000 IEEE 50th Electronic Components and Technology Conference. Piscataway：IEEE，2000，1059-1063.
[16] LAM T F，TAN C M，PENG Y K，et al. FEA evaluation on solder joint reliability of CCGA[J]. Proceedings of SPIE-The International Society for Optical Engineering，2000，4229：123-132.
[17] DARVEAUX R. Effect of simulation methodology on solder joint crack growth correlation[C]//50th Electronic Components and Technology Conference. Piscataway：IEEE，2002，1048-1058.
[18] Pang H L，Seetoh C W，Wang Z P. CBGA solder joint reliability evaluation based on elastic-plastic-creep analysis[J]. Journal of Electronic Packaging，2000，122(3)：255-261.
[19] Association Connecting Electronics Industries. IPC-9701A Guidelines for performance test methods and qualification requirements for surface mount solder attachments[S]. Bannockburn：IPC，2006.
[20] CHE F X，PANG J，XIONG B S，et al. Lead free solder joint reliability characterization for PBGA，PQFP and TSSOP assemblies[C]//2005 Electronic Components and Technology Conference. Lake Buena Vista：IEEE，2005，1048-1058.