Research Status and Development Trends for Energy Field-assisted Laser Induced Plasma-assisted Ablation of Transparent Brittle Materials

doi:10.3901/JME.2024.09.254

Abstract

Abstract: Energy field-assisted laser processing technology is a developing manufacturing technique that combines traditional laser processing with innovative approaches involving thermal, electric, magnetic, and chemical fields to enhance the controllability of the laser machining process. This integration has not only enabled the high-precision manufacturing of transparent hard brittle materials at the nano and even sub-nano scale but has also been beneficial in meeting the stringent requirements of ultra-precision manufacturing, ensuring high quality and low damage. A specific elucidation of the effects of different energy field assistance, namely thermal, magnetic, electric, and chemical fields, on laser processing technology is provided. Through an analysis of the laser mechanism and the principles of energy field assistance, the impact of thermal, electric, magnetic, and chemical fields on thermal energy, optical energy, kinetic energy, and surface energy within laser processing is summarized. Moreover, the equipment and process methods employed in energy field-assisted laser processing are introduced. Finally, an overview of the current limitations and future challenges facing energy field-assisted laser processing technology, laying the groundwork for further development of multi-field composite-assisted laser processing techniques is presented.

Key words: transparent hard brittle materials, electric field assisted laser processing, magnetic field assisted laser processing, thermal field assisted laser processing, chemical field assisted laser processing

CLC Number:

V261
TB321

JIANG Anna, YAN Lan, WANG Ningchang, JIANG Feng, LI Zhuo, WEN Qiuling, LU Xizhao, HUANG Hui. Research Status and Development Trends for Energy Field-assisted Laser Induced Plasma-assisted Ablation of Transparent Brittle Materials[J]. Journal of Mechanical Engineering, 2024, 60(9): 254-272.

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