Study on Acoustic Emission Signal Perception of Unsteady Characteristic in Micro-grinding of Monocrystalline Silicon

doi:10.3901/JME.2022.15.121

Abstract

Abstract: To solve problem of unsteady characteristics identification, the signal processing and identification method are carried out based on acoustic emission(AE) signal of unsteady feature in monocrystalline silicon micro-grinding.The single factor micro-grinding experiment of monocrystalline silicon micro-groove array is designed, and the real-time monitoring platform for the AE signal is built.The signal time domain characteristics are extracted by root mean square(RMS) method and the frequency bands are divided by wavelet packet decomposition(WPD) and fast Fourier transform(FFT).Tool tip diameter loss, micro-groove mean edge chipping width and micro-groove taper angle are selected as indexes to evaluate unsteady features of micro-grinding connected with tool wear and grinding quality variation.Furthermore, on the basis of experimental results the correlation between indexes and frequency band characteristics is discussed.The results show that the RMS of AE signal analysis interval is approximately linear with micro-groove mean edge chipping width.Low frequency band signal(0-62.5 kHz) mainly comes from mechanical vibration and friction of debris between workpiece and tool.Intermediate frequency band signal(62.5-125 kHz) mainly comes from the forming effect of the tool on the micro groove, whose energy proportion can reflect the tool wear degree.High frequency band signal(125-500 kHz) mainly comes from the material brittle fracture removal, whose energy proportion can reflect the edge chipping degree.

Key words: micro-grinding, unsteady characteristics, acoustic emission, time frequency characteristics, signal perception

CLC Number:

TG156

ZHANG Xuexue, REN Yinghui, YANG Weicheng, LI Wei, YU Kangning. Study on Acoustic Emission Signal Perception of Unsteady Characteristic in Micro-grinding of Monocrystalline Silicon[J]. Journal of Mechanical Engineering, 2022, 58(15): 121-133.

References

[1] 李伟, 周志雄, 尹韶辉, 等.微细磨削技术及微磨床设备研究现状分析与探讨[J].机械工程学报, 2016, 52(17):10-19.LI Wei, ZHOU Zhixiong, YIN Shaohui, et al. Research status analysis and review of micro-grinding technology and micro-grinding machines[J]. Journal of Mechanical Engineering, 2016, 52(17):10-19.
[2] AURICH J C, KIRSCH B, SETTI D, et al. Abrasive processes for micro parts and structures[J]. CIRP Annals-Manufacturing Technology, 2019, 68:653-676.
[3] ZHANG S J, ZHOU Y P, ZHANG H J, et al. Advances in ultra-precision machining of micro-structured functional surfaces and their typical applications[J].International Journal of Machine Tools and Manufacture, 2019, 142:16-41.
[4] 程军, 王超, 温雪龙, 等.单晶硅微尺度磨削材料去除过程试验研究[J].机械工程学报, 2014, 50(17):194-200.CHENG Jun, WANG Chao, WEN Xuelong, et al.Experimental investigation on material removal process for micro-grinding of single crystal silicon[J]. Journal of Mechanical Engineering, 2014, 50(17):194-200.
[5] AURICH J C, CARRELLA M, WALK M. Micro grinding with ultra-small micro pencil grinding tools using an integrated machine tool[J]. CIRP Annals-Manufacturing Technology, 2015, 64(1):325-328.
[6] REN Y, LI C, LI W, et al. Study on micro-grinding quality in micro-grinding tool for single crystal silicon[J]. Journal of Manufacturing Processes, 2019, 42(JUN.):246-256.
[7] 高尚, 耿宗超, 吴跃勤, 等.石英玻璃超精密磨削加工的表面完整性研究[J].机械工程学报, 2019, 55(005):186-195.GAO Shang, GENG Zongchao, WU Yueqin, et al. Surface integrity of quartz glass induced by ultra-precision grinding[J]. Journal of Mechanical Engineering, 2019, 55(005):186-195.
[8] ZHANG Tao, JIANG Feng, HUANG Hui, et al. Towards understanding the brittle-ductile transition in the extreme manufacturing[J]. International Journal of Extreme Manufacturing, 2021, 3(2):5-25
[9] LI W, REN Y, LI C, et al. Investigation of machining and wear performance of various diamond micro-grinding tools[J]. The International Journal of Advanced Manufacturing Technology, 2020, 106(3-4):1-15.
[10] CHEN S T, YEH M C. Development of an in-situ high-precision micro-hole finishing technique[J]. Journal of Materials Processing Technology, 2016, 229:253-264.
[11] HSUE A W J, CHANG Y F. Toward synchronous hybrid micro-EDM grinding of micro-holes using helical taper tools formed by Ni-Co/diamond Co-deposition[J]. Journal of Materials Processing Technology, 2016, 234:368-382.
[12] CAO X D, KIM B H, CHU C N. Hybrid micromachining of glass using ECDM and micro grinding[J]. International Journal of Precision Engineering and Manufacturing, 2013, 14(1):5-10.
[13] ZHANG J H, LI H, ZHANG M L, et al. Study on force modeling considering size effect in ultrasonic-assisted micro-end grinding of silica glass and Al2O3 ceramic[J].The International Journal of Advanced Manufacturing Technology, 2017, 89(1-4):1173-1192.
[14] LI W, CHEN Q D, REN Y, et al. Hybrid micro-grinding process for manufacturing meso/micro-structures on monocrystalline silicon[J]. Materials and Manufacturing Processes, 2020, 36(1):17-26.
[15] ROGERIO T, WENDERSON N L, PAULO R A, et al.Digital signal processing for self-vibration monitoring in grinding:A new approach based on the time-frequency analysis of vibration signals[J]. Measurement, 2019, 145:71-83.
[16] FENG J, KIM B S, SHIH A, et al. Tool wear monitoring for micro-end grinding of ceramic materials[J]. Journal of Materials Processing Technology, 2009, 209(11):5110-5116.
[17] QIN F, ZHANG L, CHEN P, et al. In situ wireless measurement of grinding force in silicon wafer self-rotating grinding process[J]. Mechanical Systems and Signal Processing, 2021, 154:107550.
[18] SUN Y, SU Z P, GONG Y D, et al. An experimental and numerical study of micro-grinding force and performance of sapphire using novel structured micro abrasive tool[J].International Journal of Mechanical Sciences, 2020, 181:105741.
[19] 温雪龙, 巩亚东, 程军, 等.铝合金Al6061微尺度磨削力热特性试验分析[J].机械工程学报, 2014, 50(23):165-174.WEN Xuelong, GONG Yadong, CHENG Jun, et al.Experimental research on force and temperature characteristics in micro-grinding Al6061[J]. Journal of Mechanical Engineering, 2014, 50(23):165-174.
[20] GU X, ZHAO Q, ZHANG J, et al. Understanding the damage evolution of sapphire under scratching from AE signals[J]. Ceramics International, 2020, 46(16):26085-26099.
[21] DIAS E A, PEREIRA F B, FILHO S, et al. Monitoring of through-feed centreless grinding processes with acoustic emission signals[J]. Measurement, 2016, 94:71-79.
[22] WANG Lihui, ROBERT X Gao. Condition monitoring and control for intelligent manufacturing[M]. London:Springer, 2006.
[23] MEI Yiming, YU Zhonghua, YANG Zhensheng.Experimental investigation of correlation between attrition wear and features of acoustic emission signals in single-grit grinding[J]. International Journal of Advanced Manufacturing Technology, 2017, 93:2275-2287.
[24] BI G, LIU S, SU S, et al. Diamond grinding wheel condition monitoring based on acoustic emission signals[J]. Sensors, 2021, 21(4):1054.
[25] JEFFREY, BADGER, STUART, et al. Acoustic emission in dressing of grinding wheels:AE intensity, dressing energy, and quantification of dressing sharpness and increase in diamond wear-flat size[J]. International Journal of Machine Tools&Manufacture Design Research&Application, 2018, 125:11-19.
[26] 陈冰, 王各, 刘建明, 等.圆弧形砂轮精密修整及其声发射在线监测技术[J].中国机械工程, 2017, 28(18):2242-2249.CHEN Bing, WANG Ge, LIU Jianming, et al. Precision truing of arc-shaped diamond wheel and on-line monitoring of truing processes by AE signals[J]. Chinese Journal of Mechanical Engineering, 2017, 28(18):2242-2249.
[27] LI J, WANG X, SHEN N, et al. Modeling of acoustic emission based on the experimental and theoretical methods and its application in face grinding[J].International Journal of Advanced Manufacturing Technology, 2018, 98(9-12):1-12.
[28] GAO Zheyu, LIN Jing, WANG Xinfeng, et al. Grinding burn detection based on cross wavelet and wavelet coherence analysis by acoustic emission signal[J].Chinese Journal of Mechanical Engineering, 2019, 32(1):68.
[29] BHUIYAN M, CHOUDHURY I A, DAHARI M, et al.Application of acoustic emission sensor to investigate the frequency of tool wear and plastic deformation in tool condition monitoring[J]. Measurement, 2016, 92:208-217.
[30] SUYA P, ARUNACHALAM N, VIJAYARAGHAVAN L.Evaluation of grinding strategy for bioceramic material through a single grit scratch test using force and acoustic emission signals[J]. Journal of Manufacturing Processes, 2019, 37:457-469.
[31] ALEXANDRE F A, LOPES W N, DOTTO F L, et al.Tool condition monitoring of aluminum oxide grinding wheel using AE and fuzzy model[J]. The International Journal of Advanced Manufacturing Technology, 2018, 96:67-79.
[32] AULESTIA M, AGUIAR P, JUNIOR P O, et al. Low-cost piezoelectric transducer for ceramic grinding monitoring[J]. IEEE Sensors Journal, 2019, 19(17):7605-7612.
[33] HAN L, LI C, GUO S, et al. Feature extraction method of bearing AE signal based on improved FAST-ICA and wavelet packet energy[J]. Mechanical Systems&Signal Processing, 2015, 62-63:91-99.
[34] 温雪龙, 巩亚东, 程军, 等.电镀金刚石微磨具磨损机理分析与试验研究[J].机械工程学报, 2015, 51(11):177-185.WEN Xuelong, GONG Yadong, CHENG Jun, et al.Mechanism analysis and experimental research on wear of electroplated diamond micro-grinding tool[J]. Journal of Mechanical Engineering, 2015, 51(11):177-185.
[35] LI W, REN Y, LI C, et al. Investigation of machining and wear performance of various diamond micro-grinding tools[J]. The International Journal of Advanced Manufacturing Technology, 2020, 106(3-4):1-15.
[36] MALKIN S, HWANG T W. Grinding mechanisms for ceramics[J]. CIRP Annals-Manufacturing Technology, 1996, 45(2):569-580.