• CN: 11-2187/TH
  • ISSN: 0577-6686

Journal of Mechanical Engineering ›› 2021, Vol. 57 ›› Issue (12): 161-168.doi: 10.3901/JME.2021.12.161

Previous Articles     Next Articles

Microstructure and Properties of Brazed Joint Between SiCf/SiC Composite and Ni-based Superalloy

YANG Jia1, ZHANG Xunye1, MA Guanglu2, LIN Panpan1, XU Yanqiang2, LIN Tiesong1,3, HE Peng1   

  1. 1. State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001;
    2. AECC Shenyang Liming Aero-Engine Co., Ltd, Shenyang 110043;
    3. Institute for Advanced Ceramics, Harbin Institute of Technology, Harbin 150080
  • Received:2020-10-07 Revised:2021-03-05 Online:2021-06-20 Published:2021-08-31

Abstract: Aiming at the poor workability of the novel high-temperature-resistant composites(SiCf/SiC), the brazing of SiCf/SiC and a Ni-base superalloy is studied. The mechanical properties and microstructural evolution of joints at different temperatures are studied, and the corresponding mechanism is clarified. Under the process parameters of 1 050℃/10 min, the room temperature shear strength of the joint reaches 79 MPa. The typical interface structure of the joint was GH536/(Ni, Cr, Mo, Fe)+TiNi3+Ti2Ni+AuCuI/TiNi3+Ti2Ni+TiNi+AuCuI/σ/Mo/Mo4.8Si3C0.6/Ti5Si3Cx/Ti5Si3Cx+TiC+AuCuI/Ti3SiC2/SiCf/SiC. When the temperature is low, the interface reactions are limited. Therefore, it is difficult to form a continuous connection Ti5Si3Cx+TiC layer at the ceramic/braze heterogeneous interface. When the brazing temperature increases to 1 050℃, a 3 μm layer of Ti3SiC2 newly forms at the heterogeneous interface to achieve efficient connection. When the temperature continues to rise to 1 100℃, the diffusion of Cr element in Mo foil increases, and an enrichment of Cr occurs at the heterogeneous interface of ceramic/braze. Currently, the excessively thick interfacial reaction layer(10 μm)is the main reason for the reduction of joint shear strength. The use of this brazing system helps to hinder the violent reactions between the base materials and relieve the thermal stress of the joint, which reduces the processing difficulty of SiCf/SiC in practical applications.

Key words: SiCf/SiC composites, GH536, Mo interlayer, microstructure, mechanical properties

CLC Number: