• CN: 11-2187/TH
  • ISSN: 0577-6686

Journal of Mechanical Engineering ›› 2020, Vol. 56 ›› Issue (8): 107-112.doi: 10.3901/JME.2020.08.107

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Hypereutectic Al-Si Alloys with Ag-28Cu Interlayer Jointed by Ultrasound-induced Transient Liquid Phase Bonding

HE Chaocheng1, FU Yu1, WANG Qian1, HAN Jian1, CHEN Shengyong2, YAN Jiuchun3   

  1. 1. School of Materials Science and Engineering, Tianjin University of Technology, Tianjin 300384;
    2. School of Computer Science and Engineering, Tianjin University of Technology, Tianjin 300384;
    3. State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001
  • Received:2019-08-05 Revised:2020-01-06 Online:2020-04-20 Published:2020-05-28

Abstract: In the atmosphere, ultrasound-induced transient liquid phase bonding is used to join Al-50Si alloy with Ag-28Cu as the interlayer. The effects of ultrasonic vibration time and joining temperature on microstructure evolution and Si particle migration of solder joints are studied. The rapid formation process of Si particle reinforced complete solid solution joints is analyzed. The relationship between shear strength and ultrasonic vibration time and joint microstructure is described. The interface metallurgical bonding is occurred by ultrasonic vibration for only 3 s at 520℃, and Si particle-reinforced complete solid solution joint is obtained by ultrasonic vibration for 15 s. The joining temperature affected the interdiffusion between Ag, Cu and Al. As the joining temperature increases, the atomic diffusion accelerates. Due to the effect of ultrasound in the solid-liquid medium, the surface oxide film between the base metal and interlayer is rapidly broken, and the element diffusion between the base metal and interlayer occurred. When the diffusion reaches a certain concentration, a metallurgical reaction occur, an Al-Ag-Cu ternary eutectic liquid phase is formed, and the Si particles migrate into the ternary eutectic liquid phase. With the ultrasonic vibration time prolongs, under the action of ultrasonic vibration and pressure, the ternary eutectic alloy decreases until it disappeared completely, the remaining Al (Ag, Cu) solid solution remained in the solder joint, the solder joint is closed, and the Si particle-reinforced complete solid solution joint is obtained. The migration of Si particles and ternary eutectic alloy affects the shear strength of the joint, and the shear strength increases with the ultrasonic vibration time. The sheared sample with an ultrasonic vibration time of 15 s, whose fracture occurred in the base metal and belonged to a ductile fracture, and the joint has the highest shear strength of about 123 MPa.

Key words: ultrasonic, Al-Si, Si particles, solid solution, ternary eutectic, shear strength

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