Measurement and Evaluation of Full Circumferential Three-dimensional Surface Topography of Diamond Wire Saw Based on Contour Method

doi:10.3901/JME.2019.20.107

Abstract

Abstract: Aiming at measuring and quantitatively evaluating the full circumferential three-dimensional surface topography of millimetric scale diamond wire saw and micro scale abrasive, a surface circumferential scanning method based on microscopic images contours is proposed. First, Point cloud data is obtained by processing sequential scanning microscopic contour images of diamond wire saw. Then the spatial coordinates of point cloud data are obtained, and three-dimensional surface topography are reconstructed by using cubic spline interpolation and coordinate transformation. Besides the common evaluation parameters of diamond wire saw, more evaluation parameters are defined on the basis of the 2D projection contours and 3Dreconstructed surface topography. Based on the self-developed measurement system, two wire saws (diameters 0.250 mm and 0.320 mm; grains diameter in the range of 30-40 μm) are measured and evaluated. Experimental results indicate that the proposed method can be used to measure the full circumferential three-dimensional surface topography of diamond wire saw without multiple stitching, and comprehensively evaluate wire saws using the characteristic parameters, which provide useful objective basic data for the manufacturing and the process optimization of wire saws.

Key words: diamond wire saw, surface topography, contour measurement method, evaluation

CLC Number:

TG156

LI Zhenyu, CUI Changcai, HUANG Hui, XU Xipeng. Measurement and Evaluation of Full Circumferential Three-dimensional Surface Topography of Diamond Wire Saw Based on Contour Method[J]. Journal of Mechanical Engineering, 2019, 55(20): 107-115.

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