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CN: 11-2187/TH
ISSN: 0577-6686
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JME College
中文
Research on Defects Inspection of Solder Bumps Using Active Infrared Thermography Technology
LU Xiangning, HE Zhenzhi, HU Ningning, SU Lei, NIE Lei
Journal of Mechanical Engineering . 2016, (
10
): 17 -24 . DOI: 10.3901/JME.2016.10.017
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