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CN: 11-2187/TH
ISSN: 0577-6686
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JME College
中文
Bond Reliability under High Temperature and Humid Environment for Copper Bonding Wire
CAO Jun, FAN Junling, SHANG Xianguang, LIU Zhiqiang
Journal of Mechanical Engineering . 2016, (
6
): 86 -91 . DOI: 10.3901/JME.2016.06.086
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