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CN: 11-2187/TH
ISSN: 0577-6686
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JME College
中文
Effect of Bi and Ni Concentration on the Creep Behavior of the Bulks of Cu/SAC/Cu Micro Solder Joints
KONG Xiangxia, SUN Fenglian, YANG Miaosen, LIU Yang
Journal of Mechanical Engineering . 2017, (
2
): 53 -60 . DOI: 10.3901/JME.2017.02.053
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