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CN: 11-2187/TH
ISSN: 0577-6686
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JME College
中文
Review on the through Silicon Via Technology in the 3D-system in Package (3D-SiP)
WANG Meiyu, ZHANG Haobo, HU Weibo, MEI Yunhui
Journal of Mechanical Engineering . 2024, (
19
): 261 -276 . DOI: 10.3901/JME.2024.19.261
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