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CN: 11-2187/TH
ISSN: 0577-6686
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中文
Development and Evaluation of Soft Abrasive Grinding Wheel for Silicon Wafer in Wet Mechanical Chemical Grinding
ZHANG Yu, KANG Renke, GAO Shang, HUANG Jinxing, ZHU Xianglong
Journal of Mechanical Engineering . 2023, (
3
): 328 -336 . DOI: 10.3901/JME.2023.03.328
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