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CN: 11-2187/TH
ISSN: 0577-6686
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中文
Research Progress of Low-Silver Sn-0.3Ag-0.7Cu Solder for Electronic Packaging
KONG Xiangxia, ZHAI Junjun, SUN Fenglian
Journal of Mechanical Engineering . 2022, (
12
): 39 -54 . DOI: 10.3901/JME.2022.12.039
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