• CN: 11-2187/TH
  • ISSN: 0577-6686
Analysis of The Influence of Plate Modal Coupling on Sound Power Under Thermal Load
CHEN Junlin, XIAO Xinbiao, YAO Dan, LI Muxiao, HAN Jian
Journal of Mechanical Engineering . 2022, (7): 131 -140 .  DOI: 10.3901/JME.2022.07.131