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CN: 11-2187/TH
ISSN: 0577-6686
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中文
Tensile Performance of Inhomogeneous Microscale Cu/Sn-58Bi/Cu Solder Joints under Electro-thermo-mechanical Coupled Loads
LI Wangyun, LI Xingmin, WANG Jian, LIANG Jingyang, QIN Hongbo
Journal of Mechanical Engineering . 2022, (
2
): 307 -320 . DOI: 10.3901/JME.2022.02.307
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