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CN: 11-2187/TH
ISSN: 0577-6686
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中文
Experiment and Numerical Simulation of Shear Creep of Cu/SAC305/Cu Microscale Solder Joints
YIN Limeng, SU Zilong, ZUO Cunguo, ZHANG Zhongwen, YAO Zongxiang, WANG Gang, WANG Shanlin, CHEN Yuhua
Journal of Mechanical Engineering . 2022, (
2
): 300 -306 . DOI: 10.3901/JME.2022.02.300
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