×
模态框（Modal）标题
在这里添加一些文本
Close
Close
Submit
Cancel
Confirm
×
模态框（Modal）标题
×
CN: 11-2187/TH
ISSN: 0577-6686
Nav
Home
About
About Journal
Awards and Inclusion
Editorial Board
Board of Directors
Editorial Team
Author Center
Online Submission
Manuscript Tracking
Instruction
Download
Review Center
Peer Review
Office Work
Editor-in-Chief
Volunteer to Review
Subscription
Contacts Us
E-mail Alert
JME College
中文
Size Effects of Growth and Evolution of Interfacial Intermetallic Compound and the Mechanical Behavior of Bump Structure Sn3.0Ag0.5Cu/Cu Cross-scale Joints in Electronic Packages
ZHOU Minbo, ZHAO Xingfei, CHEN Mingqiang, KE Changbo, ZHANG Xinping
Journal of Mechanical Engineering . 2022, (
2
): 259 -268 . DOI: 10.3901/JME.2022.02.259
Copyright © Journal of Mechanical Engineering |
京ICP备05055788号-30
