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CN: 11-2187/TH
ISSN: 0577-6686
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JME College
中文
Stress Issues in 3D Interconnect Technology Using Through Glass Vias
ZHAO Jin, LI Wei, ZHONG Yi, YU Daquan, QIN Fei
Journal of Mechanical Engineering . 2022, (
2
): 246 -258 . DOI: 10.3901/JME.2022.02.246
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