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CN: 11-2187/TH
ISSN: 0577-6686
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JME College
中文
Research Progress on the Reliability of Solder Joint for Advanced Microelectronic Packaging
GAO Liyin, LI Caifu, LIU Zhiquan, SUN Rong
Journal of Mechanical Engineering . 2022, (
2
): 185 -202 . DOI: 10.3901/JME.2022.02.185
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