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CN: 11-2187/TH
ISSN: 0577-6686
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JME College
中文
Research Progress of Material Removal Mechanism in Chemical Mechanical Planarization for Metal Interconnection Layer of Chips
HANG Tao, CHANG Pengfei, LI Ming
Journal of Mechanical Engineering . 2022, (
2
): 147 -158 . DOI: 10.3901/JME.2022.02.147
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