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CN: 11-2187/TH
ISSN: 0577-6686
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JME College
中文
High Temperature Creep Behavior of Sn-Ag-Cu Solder Joints Reinforced by Graphene via Nanoindentation
LI Yuan, XU Lianyong, GAO Yu, JING Hongyang, ZHAO Lei, HAN Yongdian
Journal of Mechanical Engineering . 2022, (
2
): 50 -57 . DOI: 10.3901/JME.2022.02.050
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