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CN: 11-2187/TH
ISSN: 0577-6686
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JME College
中文
Model of Grain Depth of Cut in Wafer Rotation Grinding Method for Silicon Wafers
GAO Shang, WANG Ziguang, KANG Renke, DONG Zhigang, ZHANG Bi
Journal of Mechanical Engineering . 2016, (
17
): 86 -93 . DOI: 10.3901/JME.2016.17.086
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