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CN: 11-2187/TH
ISSN: 0577-6686
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JME College
中文
Analysis and Optimization of Residual Stress after Reflow Soldering of BGA Lead Free Solder Joints
ZHAO Shengjun, HUANG Chunyue, LIANG Ying, KUANG Bing, TANG Xiangqiong
Journal of Mechanical Engineering . 2020, (
10
): 86 -94 . DOI: 10.3901/JME.2020.10.086
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