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CN: 11-2187/TH
ISSN: 0577-6686
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JME College
中文
Microstructures and Property of SnAgCu/SnAgCuCe Solder Joints
ZHANG Liang;HAN Jiguang;GUO Yonghuan;LAI Zhongmin;ZHANG Liang
. 2012, (
8
): 67 -73 .
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