• CN: 11-2187/TH
  • ISSN: 0577-6686

Journal of Mechanical Engineering ›› 2024, Vol. 60 ›› Issue (23): 246-261.doi: 10.3901/JME.2024.23.246

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Research Status Analysis of Low Temperature Plasma and Its Compound Processing Technology on the Surface of Hard and Brittle Components

LI Wei1,2, HU Xiaolong1, DUAN Huigao1,2, DENG Hui3, HUANG Xiangming1, REN Yinghui1, Ahmed Mohamed Mahmoud Ibrahim4   

  1. 1. College of Mechanical and Vehicle Engineering, Hunan University, Changsha 410082;
    2. Greater Bay Area Institute for Innovation, Hunan University, Guangzhou 511300;
    3. College of Engineering, Southern University of Science and Technology, Shenzhen 518055;
    4. Faculty of Engineering, Minia University, El-Minya 61519 Egypt
  • Received:2023-12-10 Revised:2024-07-18 Online:2024-12-05 Published:2025-01-23

Abstract: Driven by the chip, lithography, laser fusion device and other national key projects, the demand for high-precision and high-quality hard and brittle components is becoming increasingly urgent. However, the existing technologies used for semiconductor wafers, optical components and other hard and brittle components surface machining still have many limitations and are far from meeting the actual needs. Low-temperature plasma processing technology has the advantages of no mechanical contact and strong flexibility, and can achieve high efficiency and near-damage-free processing of hard and brittle material component surfaces. However, it still faces serious challenges in processing uniformity and surface accuracy. Therefore, it is necessary to deeply analyze the research status, problems and development trends of plasma machining mechanism, processes and equipment, so as to provide technical reference and guidance for the high-precision and high-quality machining of hard and brittle component surfaces. This paper analyzes the plasma processing mechanism at the atomic scale and summarizes the current research status of plasma processing technology and equipment for hard and brittle components. On this basis, the problems of plasma and its processing equipment have been discussed. The development directions of plasma processing technology are thus pointed out to promote the popularization and application of plasma technology in the processing of hard and brittle components. Furthermore, it aims to boost the manufacturing level of ultra-precision machining of hard and brittle components such as semiconductor wafers and optical components in China and support the development of national key projects.

Key words: hard and brittle components, plasma, polishing, modified, lapping

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