Research on Particle Damage during SiCp/Al Composite Machining

doi:10.3901/JME.2023.15.366

Abstract

Abstract: Particle damage easily occurs during dynamic removal of SiCp/Al composites. To improve the machining of SiCp/Al composites, it is necessary to avoid or take advantage of the effect of particle damage on the machinability of composites. Therefore, the particle damage and its influence on the machinability are deeply investigated in cutting of SiCp/Al composites. Firstly, the particle damage mechanism is revealed based on the dislocation packing theory and the observation of chip root. The interfacial decohesion is mainly caused by the stress concentration due to the pile-up of dislocations. Particle breakage was induced by the stress concentration, the tool edge squeezing particle, the local extrusion of particles, and the formation of the rigid network of particles. Secondly, a model of particle damage for the cutting of SiCp/Al composite is established, based on the dynamic constitutive model with particle effects, Eshelby's theory, Weibull distribution and the analysis of edge-particle contact. Then, the model is verified with the image processing technology. Finally, according to the prediction results, the influence of particle damage on the machining of SiCp/Al composites is analyzed. The conclusions showed that the increase of particle damage led to the enhancement of the saw-tooth profile of chips, and the serious deterioration of the machined surface quality. Particle damage significantly affected the particle strengthening effect, causing the cutting force to increase first and then decrease with an increase in particle content, and to decrease with the increase of particle size.

Key words: SiCp/Al composite, cutting, particle damage, mechanism, theoretical modeling

CLC Number:

TG506

SUN Wei, WANG Peijun, CHEN Junyun, DUAN Chunzheng. Research on Particle Damage during SiCp/Al Composite Machining[J]. Journal of Mechanical Engineering, 2023, 59(15): 366-376.

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