Study on Microstructure Evolution of GH4742 Alloy under Thermo-mechanical Coupling Based on LAM Technology

doi:10.3901/JME.2022.16.110

Abstract

Abstract: The control of grain size plays an important role on metal materials to obtain excellent mechanical properties, especially for nickel-based superalloy with high content of precipitated phase. The interaction between precipitates and grains is complex in the process of recrystallization and grain growth during hot deformation and solution treatment. In addition, the traditional small sample hot compression simulation method can not meet the research needs. Taking GH4742 alloy as the research object, the whole grain evolution of cross section was studied through the hot deformation and solution tests of large size biconical samples at 1080 ℃, deformation speed of 5 mm/s and maximum reduction of 60 %, combined with the global crystal characterization of EBSD large area montage technology. The results show that the grain size evolution of GH4742 during hot deformation is dominated by discontinuous dynamic recrystallization, which is closely related to strain energy storage and is inhibited by precipitated phase pinning. When the pinning force is constant, the different grain orientation leads to the difference of recrystallization driving force, and the recrystallization nucleation and growth show non-uniform distribution. Due to the pinning effect of precipitated phase and the homogenization of dislocation substructure, the nucleation and growth of recrystallization are inhibited in the process of sub-solvu treatment, and there are still many deformed grains. After super-solvu treatment, the grain size distribution is uniform, and the average grain size is 232 μm.

Key words: GH4742 alloy, microstructure evolution, large area montage, strain gradient, dynamic recrystallization

CLC Number:

TG316

ZHANG Wenwen, LIU Xingang, LI Haizhu, HE Yini, KE Yujiao, QIN Heyong, TIAN Qiang. Study on Microstructure Evolution of GH4742 Alloy under Thermo-mechanical Coupling Based on LAM Technology[J]. Journal of Mechanical Engineering, 2022, 58(16): 110-120.

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