Dynamic Recrystallization Model Analysis of New Type High Quality GH738 Alloy during Its Hot Deformation Processes

doi:10.3901/JME.2022.10.059

Abstract

Abstract: Series hot compression tests of the new type alloy of high-quality GH738 were carried out under low-cycle fatigue tester of MTS810-25T, the microstructure evolution of dynamic recrystallization(DRX) for this alloy under different hot deformation conditions, including initial grain sizes (range of 42-340 μm), temperature (range of 1 020-1 100 ℃), strain rate (range of 0.01-1 s^?1), and engineering strain (range of 0.15-0.70) was systematically investigated. Then, series Avrami-type model of its dynamic recrystallization was established. The verification of the dynamic recrystallization model by numerical simulation using DEFORM software and typical compression test was conducted. The results show as follows: The volume fraction for the new type alloy of high-quality GH738 during dynamic recrystallization processes increases with the decrease of initial grain size, the decrease of strain rate, and increasing of the deformation temperature and strain. Based on the quantitative metallography and nonlinear fitting method， the critical strain model, volume fraction model and grain size model of the new type alloy of high-quality GH738 were established. Coupled the above established dynamic recrystallization model of the new type alloy of high-quality GH738 in finite analysis software of DEFORM, and contracted the simulation results to typical compression test, indicate that the dynamic recrystallization model for this alloy can provide effective prediction for microstructure control in actual hot working process.

Key words: the new type alloy of high-quality GH738, hot deformation, microstructure evolution, dynamic recrystallization model

CLC Number:

TG132

GUO Jing, NIU Wenlong, MA Siwen, ZHANG Maicang. Dynamic Recrystallization Model Analysis of New Type High Quality GH738 Alloy during Its Hot Deformation Processes[J]. Journal of Mechanical Engineering, 2022, 58(10): 59-67.

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