Influence of Ultrasonic Vibration on Material Removal of Scratching on RB-SiC with Single Diamond Tool

doi:10.3901/JME.2019.01.225

Abstract

Abstract: Ultrasonic assisted grinding (UAG) shows great advantages on the machining of hard and brittle materials. To enhance the application of UAG, it is important to investigate its basic mechanism. A single diamond tool is used to conduct ultrasonic assisted scratching (UAS) tests for the purpose of imitating the material removal behavior of a single grain on the grinding wheel. The nominal and tangential scratching forces are compared under different ultrasonic amplitudes. The topographical characteristics are analyzed, including the width, depth and cross section area of the scratched grooves. The influence of ultrasonic vibration on the material removal behavior is discussed based on the scratching force, topographical characteristics and tool wear. It is observed that the scratching force significantly descended while the material removal significantly ascended with the help of ultrasonic vibration. The high-frequency impact and the intermittent energy input are considered the cause of observed UAS features.

Key words: RB-SiC, scratch topography, scratching force, single diamond, ultrasonic assisted scratching

CLC Number:

TH161

ZHENG Feifei, DONG Zhigang, ZHANG Jiatong, LIU Jinting, KANG Renke. Influence of Ultrasonic Vibration on Material Removal of Scratching on RB-SiC with Single Diamond Tool[J]. Journal of Mechanical Engineering, 2019, 55(1): 225-232.

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