[1] |
DU Suigeng, LIU Guanxiang, CHEN Hu, HU Hongyi, LI Ju.
Microstructure and Texture Evolution of the Weld Zone during Linear Friction Welding between TC17(α+β) and TC17(β)
[J]. Journal of Mechanical Engineering, 2024, 60(2): 99-106.
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[2] |
GAO Kai, GU Hongli, LI Kun.
Cr, Si Trace Elements on Steel/Aluminium Induction Hydrostatic Welding Joint Organization and Properties of the Impact
[J]. Journal of Mechanical Engineering, 2024, 60(2): 178-187.
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[3] |
ZHANG Shuye, DUAN Xiaokang, LUO Keyu, XU Sunwu, ZHANG Zhihao, CHEN Jieshi, HE Peng.
Current Status of Electronic Packaging Materials Using Machine Learning
[J]. Journal of Mechanical Engineering, 2023, 59(22): 222-233.
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[4] |
LI Geng, FENG Jiayun, WANG Shang, WU Peng, TIAN Yanhong.
Process Optimization and Failure Mechanisms of Au-Al Wire Bonding for T/R Components
[J]. Journal of Mechanical Engineering, 2023, 59(22): 322-331.
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[5] |
TANG Shuwei, LUO Dongming, WU Mengxiu, ZHANG Jingyi, HE Zikang.
Substituent Effects of Mg, Ag, and Si on Electronic Structures and Mechanical Properties of AlCu3 Alloy
[J]. Journal of Mechanical Engineering, 2023, 59(18): 207-218.
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[6] |
CHENG Qi, GUO Ning, ZHANG Di, ZHANG Shuai, CHEN Hao, HE Jinlong.
Research Progress on Laser Welding of NiTi Shape Memory Alloy Dissimilar Materials
[J]. Journal of Mechanical Engineering, 2023, 59(16): 182-191.
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[7] |
WANG Xiaoqiang, GAO Xiaolong, LIU Jing, LI Lunkun.
ffects of V/Nb Composite Interlayer on Microstructure and Mechanical Properties of NiTi Alloy/Stainless Steel Dissimilar Metal Laser Welding
[J]. Journal of Mechanical Engineering, 2022, 58(8): 136-142.
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[8] |
LI Ce, WANG Bingguang, CHANG Xufeng, MA Zhaolong, CHENG Xingwang.
Research Progress on the Influence Mechanisms of βSn Structure and Grain Orientation on the Reliabilities of Solder Joints
[J]. Journal of Mechanical Engineering, 2022, 58(2): 203-222.
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[9] |
ZHOU Minbo, ZHAO Xingfei, CHEN Mingqiang, KE Changbo, ZHANG Xinping.
Size Effects of Growth and Evolution of Interfacial Intermetallic Compound and the Mechanical Behavior of Bump Structure Sn3.0Ag0.5Cu/Cu Cross-scale Joints in Electronic Packages
[J]. Journal of Mechanical Engineering, 2022, 58(2): 259-268.
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[10] |
WANG Fengjiang, HE Qihang.
Effect of Trace Zn Addition on Interfacial Evolution and Mechanical Properties of Sn-58Bi/Cu Solder Joints during Aging
[J]. Journal of Mechanical Engineering, 2022, 58(2): 284-290.
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[11] |
LI Shengli, REN Chunxiong, HANG Chunjin, TIAN Yanhong, WANG Chenxi, CUI Ning, JIANG Qian.
Microstructure Evolution of Sn-3.0Ag-0.5Cu Solder Joints under Extreme Temperature Changes and Current Stressing
[J]. Journal of Mechanical Engineering, 2022, 58(2): 291-299.
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[12] |
LI Deli, WANG Rui, ZHANG Han, LIN Kaijie, GU Dongdong.
Laser Powder Bed Fusion of Ti/Al Layered Composites: Forming Quality, Interface Characteristic and Mechanical Properties
[J]. Journal of Mechanical Engineering, 2022, 58(17): 288-296.
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[13] |
KONG Xiangxia, ZHAI Junjun, SUN Fenglian.
Research Progress of Low-Silver Sn-0.3Ag-0.7Cu Solder for Electronic Packaging
[J]. Journal of Mechanical Engineering, 2022, 58(12): 39-54.
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[14] |
ZHAO Guolong, XIA Hongjun, LI Liang, XIN Lianjia, HE Ning.
Investigation on Laser-induced Controllable Oxidation Assisted Micro Milling of Titanium Aluminum Intermetallic Alloy
[J]. Journal of Mechanical Engineering, 2021, 57(9): 254-263.
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[15] |
LI Huan, ZHOU Kang, CAO Biao, ZHANG Jinzhou.
Analysis of Welding Interface and Joint Properties of High Power Ultrasonic Welding of Aluminum Alloy
[J]. Journal of Mechanical Engineering, 2021, 57(6): 87-95.
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