Abstract: The designs of the optical fiber embedded structure in PCB-level circuit not only needs optical link alignment, but also ensure that fiber is not damaged in the process of laminating process. It increases the difficulty to PCB manufacturing. So the problems which may take place during the manufacturing process and design a new kind of optical fiber embedded structure is studied. Optical fiber embedded process is introduced and optical fiber fracture mechanism is analyzed in theory. The simulation model of the optical fiber embedded structure based on the finite element theory is established and the optical fiber embedded process was analyzed by numerical simulation. The results indicate that the maximum stress in the lamination process can be reduced by filling with epoxy glue and the groove shapes also have influence on the maximum stress. An original groove type topology structure is designed. The stress condition is analyzed when optical fiber embedding the groove structure and discussed the relationship between the maximum stress on optical fiber and the angle in the bottom of the groove, also the distance optical fiber to the groove wall. Combined with practical engineering, the influence is researched which to the stress caused by fiber size tolerance and scribing machining precision. It shows that the design of the optical fiber embedded structure not only effectively reduces the maximum stress which the fiber enduring in the manufacturing process, but also has good workability on the premise of guaranteeing optical link alignment.

Key words: optical fiber embedded, photoelectric interconnection, process simulation, structure design