Abstract: Kinematic model for rotating and swing drive plane polishing process is deduced, effect of opening holes in the fir polishing plate on the uniformity during hydration polishing is revealed. Under the condition of rotating and swing drive plane polishing, distribution of opening holes have great effect on the global and local uniformity of sapphire substrates during hydration polishing. Same characteristics of line, circular and spiral holes are expressed as stepped straight for different areas of sapphire substrate. Compared with polishing plates with line and circular holes, spiral holes can achieve better global and local uniformity under certain conditions.

Key words: hydration polishing, rotating and swing drive, sapphire wafer, uniformity of kinematic trajectory