电弧增材成形单道两层熔积过程中的晶粒生长模拟
周祥曼, 田启华, 杜义贤, 柏兴旺, 张海鸥
Simulation of Grain Growth in Single-pass Two-layer Deposition of Arc Welding Based Additive Forming Process
ZHOU Xiangman, TIAN Qihua, DU Yixian, BAI Xingwang, ZHANG Haiou
机械工程学报
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2018, (22): 86
-94
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DOI: 10.3901/JME.2018.22.086
