PCB组装板多器件焊点疲劳寿命跨尺度有限元计算

doi:10.3901/JME.2019.06.054

机械工程学报 ›› 2019, Vol. 55 ›› Issue (6): 54-60.doi: 10.3901/JME.2019.06.054

• 特邀专栏：焊接力学与结构设计 • 上一篇下一篇

PCB组装板多器件焊点疲劳寿命跨尺度有限元计算

李跃¹, 田艳红¹, 丛森², 张伟玮²

1. 哈尔滨工业大学先进焊接与连接国家重点实验室哈尔滨 150001;
2. 中国工程物理研究院电子工程研究所绵阳 621900

收稿日期:2018-06-19 修回日期:2018-12-14 出版日期:2019-03-20 发布日期:2019-03-20
通讯作者: 田艳红(通信作者),女,1975年出生,博士,教授,博士研究生导师。主要研究方向为微连接方法及基础、电子封装及可靠性、纳米材料与器件。E-mail:tianyh@hit.edu.cn
作者简介:李跃,男,1995年出生。主要研究方向为微连接与电子封装。E-mail:yueli@hit.edu.cn
基金资助:
国家自然科学基金资助项目（U1730107）。

Multi-scale Finite Element Analysis into Fatigue Lives of Various Component Solder Joints on Printed Circuit Board

LI Yue¹, TIAN Yanhong¹, CONG Sen², ZHANG Weiwei²

1. State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001;
2. Institute of Electronic Engineering, China Academy of Engineering Physics, Mianyang 621900

Received:2018-06-19 Revised:2018-12-14 Online:2019-03-20 Published:2019-03-20

摘要/Abstract

摘要： 随着电子设备向着小型化、多功能化方向发展，互连的可靠性越来越受到人们的重视。现有研究的分析对象大多为单个器件，而实际服役过程中，印制电路板（Printed circuit board，PCB）的形变、传热、受力情况都将对焊点可靠性产生影响。传统焊点可靠性有限元分析以单一器件为基础，而将仿真对象扩展为整个PCB板，对于提升焊点可靠性评估的准确性和有效性具有重要的意义。利用ANSYS有限元软件，对处于不同尺度的焊点、器件以及PCB板进行建模，分析再流焊载荷下各器件焊点的残余应力应变分布，讨论热循环后各器件焊点的危险位置，并根据修正的Coffin-Manson模型，给出各封装类型焊点的热循环寿命。通过与器件级焊点可靠性模拟结果的对比，说明板级有限元分析的必要性和不可替代性，进一步完善焊点可靠性有限元分析理论。

关键词: 板级模拟, 多尺度模拟, 疲劳寿命, 有限元分析

Abstract: With the miniaturization and multifunction of electronic component, the interconnection reliability has attracted more and more attention. Individual component has been analyzed in previous works. However when it enters service, the deformation, the heat conduction and the load of printed circuit board (PCB) will make a difference to the reliability of solder joint. Traditional finite element analysis into the solder joint is based on the component itself, but it can improve the accuracy and effectiveness of reliability assess into the solder joint when changing the simulation object into the whole PCB. The multi-scale solder joints, components and PCB are modeled and analyzed using ANSYS finite element software. The residual strain and stress distribution of the solder joint after reflow process are analyzed. The dangerous positions of the solder joint are discussed and the fatigue lives of solder joints in different packages are calculated using modified Coffin-Manson model. Comparison between the board level and the component level results shows the necessity and irreplaceability of board level simulation and helps to perfect the finite element theory into the fatigue life of the solder joint.

Key words: board level simulation, fatigue life, finite element analysis, multi-scale simulation

中图分类号:

TG425

李跃, 田艳红, 丛森, 张伟玮. PCB组装板多器件焊点疲劳寿命跨尺度有限元计算[J]. 机械工程学报, 2019, 55(6): 54-60.

LI Yue, TIAN Yanhong, CONG Sen, ZHANG Weiwei. Multi-scale Finite Element Analysis into Fatigue Lives of Various Component Solder Joints on Printed Circuit Board[J]. Journal of Mechanical Engineering, 2019, 55(6): 54-60.

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PCB组装板多器件焊点疲劳寿命跨尺度有限元计算

Multi-scale Finite Element Analysis into Fatigue Lives of Various Component Solder Joints on Printed Circuit Board

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