[1] 陈钧武,何士恒. 电铸原理与工艺[M]. 北京:化学工业出版社, 2010. CHEN Junwu, HE Shiheng. Principle and process of electroforming[M]. Beijing:Chemical Industry Press, 2010.
[2] 刘冲,李苗苗,施维枝,等. 基于SU-8厚胶光刻工艺的微电铸铸层尺寸精度控制新方法[J]. 机械工程学报, 2011, 47(3):179-185. LIU Chong, LI Miaomiao, SHI Weizhi, et al. New method for dimensional precision control of electroformed parts by using micro electroforming technique with SU-8 Thick photoresist[J]. Journal of Mechanical Engineering, 2011, 47(3):179-185.
[3] MICHAEL B, THOMAS S, BOGUSLAW W, et al. Highly precise micro-retroreflector array fabricated by the LIGA process and its application as tapped delay line filter[J]. Applied Optics, 2012, 51(25):5995-5999.
[4] 杨光,皮钧. 反光膜微结构阵列电铸电流密度分析[J]. 电镀与环保, 2014(3):22-26. YANG Guang, PI Jun. An analysis of density distribution in microstructure array electroforming of reflective membrane[J]. Electroplating & Pollution Control, 2014(3):22-26.
[5] DU L Q, YANG T, ZHAO M, et al. Study on improving thickness uniformity of microfluidic chip mold in the electroforming process[J]. Micromachines, 2016, 7(1):7-12.
[6] LI J, ZHANG P, WU Y, et al. Uniformity study of nickel thin-film microstructure deposited by electroplating[J]. Microsystem Technologies, 2009, 15, 505-510.
[7] 杨光, 叶飞. 间接超声下电铸液温升及微棱镜镍层反光性能[J]. 功能材料, 2014, 43(8):883-888. YANG Guang, YE Fei. Temperature rise and reflective performance of nickel films with microprism structure electrodeposited atindirect-ultraconic electrochemical deposition[J]. Journal of Functional Materials, 2014, 43(8):883-888.
[8] ZHAO Z, DU L Q, TAO Y S, et al. Enhancing the adhesion strength of micro electroforming layer by ultrasonic agitation method and the application[J]. Ultrasonics Sonochemistry, 2016, 33(4):21-25.
[9] MING P M, ZHU D, HU Y Y, et al. Experimental research on microelectroforming with ultrasonic agitation[J]. Key Engineering Materials, 2008, 375, 253-257.
[10] BECKETT M A, HUA I. Impact of ultrasonic frequency on aqueous sonoluminescence and sonochemistry[J]. Journal of Physical Chemistry A, 2001, 105, 3796-3802.
[11] LIU W Q, LEI W N, WANG C Y, et al. Ni-SiC nanocomposites electroplating process under ultrasonic and agitation[J]. Integrated Ferroelectrics, 2015, 167(1):192-198.
[12] 明平美,朱荻,胡洋洋,等. 超声微细电铸试验研究[J]. 中国机械工程, 2008, 19(6):644-647. MING Pingmei, ZHU Di, HU Yangyang, et al. Experimental research on microelectroforming with ultrasound stirring[J]. China Mechanical Engineering, 2008, 19(6):644-647.
[13] 翟言强,李克智,李贺军,等. 超声电沉积碳/碳复合材料磷灰石涂层的工艺优化[J]. 材料工程, 2007(4):27-31. ZHAI Yanqiang, LI Kezhi, LI Hejun, et al. Optimization of process parameters of calcium phos phate coating on C/C composites by sonoelectrode position technique[J]. Journal of Materials Engineering, 2007(4):27-31.
[14] 吴蒙华,傅欣欣,李智,等. 超声电沉积镍/纳米碳化硅复合镀层组织结构研究[J]. 机械工程材料, 2004, 28(12):46-48. WU Menghua, FU Xinxin, LI Zhi, et al. Microstructure of ultrasonic-electrode positing Ni/Nano-SiC composite coatings[J]. Materials for Mechanical Engineering, 2004, 28(12):46-48.
[15] DALAS E. The effect of ultrasonic field on calcium carbonate scale formation[J]. Journal of Crystal Growth, 2001, 222(1):287-292.
[16] 夏法锋,吴蒙华,贾振元,等. 超声波对纳米Ni-TiN复合镀层的影响[J]. 功能材料, 2008, 39(4):690-691. XIA Fafeng, WU Menghua, JIA Zhenyuan, et al. Effect of ultrasonic wave on nano Ni-TiN composite coatings[J]. Journal of Functional Materials, 2008, 39(4):690-691.
[17] 杨艳玲,申勇峰,陈进耿,等. 超声波搅拌-脉冲电沉积法制备纳米镍[J]. 金属学报, 2007, 43(8):883-888. YANG Yanling, SHEN Yongfeng, CHEN Jingeng, et al. Nanocrystallne nickelcoating prepared by pulsed electrodeposition combined with ultrasonic agitation[J]. Acta Metallurgica Sinica, 2007, 43(8):883-888.
[18] 刘剑飞. 超声改善微电铸铸层均匀性研究[D]. 大连:大连理工大学, 2013. LIU Jianfei. Improvement of thickness uniformity of micro-electroformed layers by ultrasonic agitation[D]. Dalian:Dalian University of Technology, 2013.
[19] 胡海昌. 多自由度结构固有振动理论[M]. 北京:科学出版社, 1987. HU Haichang. The theory of natural vibration of multi-degree freedom structure[M]. Beijing:Science Press, 1987.
[20] 李荻. 电化学原理[M]. 北京:北京航空航天大学出版社, 1998. LI Di. Electrochemical principle[M]. Beijing:Press of Beijing University of Aeronautics and Astronautics, 1998.
[21] SCHARIFKER, B, HILLS, G. Theoretical and experimental studies of multiple nucleation[J]. Electrochimca Acta 1983, 28(7), 879-889.
[22] BARD A J, FAULKNER L R. Electrochemical methods fundamentals and applications[M]. New York:Press of John Wiley & Sons, 1980.
[23] 吴小英,杨丽坤,闫慧,等. n型半导体硅电极表面Au的电化学成核机理[J]. 物理化学学报, 2015, 31(9):1708-1714. WU Xiaoying, YANG Likun, YAN Hui, et al. Electrochemical nucleation of Au on n-type semiconductor silicon electrode surface[J]. Acta Physico-Chimica Sinica, 2015, 31(9), 1708-1714.
[24] 冯若,李化茂. 声化学及其应用[M]. 合肥:安徽科技出版社, 1992. FENG Ruo, LI Huamao. Sonochemistry and its aplications[M]. Hefei:Anhui Science & Technology Press, 1992.
[25] SUSLICK K S. Sonochemistry[J]. Science, 1990, 247:1439-1445.
[26] AMARA N, RATSIMBA B, WILHELM A, et al. Growth rate of potash alum crystals:Comparison of silent and ultrasonic conditions[J]. Ultrasonics Sonochemistry, 2004, 11(1):17-21. |