• CN:11-2187/TH
  • ISSN:0577-6686

机械工程学报 ›› 2018, Vol. 54 ›› Issue (3): 196-202.doi: 10.3901/JME.2018.03.196

• 制造工艺与装备 • 上一篇    下一篇

金刚石砂轮V形尖端切向磨削修整试验研究

梁志强, 吴立飞, 周天丰, 张素燕, 王秋燕, 焦黎, 王西彬   

  1. 北京理工大学先进加工技术国防重点学科实验室 北京 100081
  • 收稿日期:2017-01-13 修回日期:2017-07-24 出版日期:2018-02-05 发布日期:2018-02-05
  • 通讯作者: 梁志强(通信作者),男,1984年出生,博士,副教授,硕士研究生导师。主要研究方向为难加工材料切削磨削,微细刀具设计与刃磨。E-mail:liangzhiqiang@bit.edu.cn
  • 作者简介:吴立飞,男,1991年出生,硕士研究生。主要研究方向为微结构磨削技术。E-mail:wulifei1991@126.com
  • 基金资助:
    国家重点基础研究计划(973计划,2015CB059900)、基础科研(A0920132008)和国家自然科学基金(51575049)资助项目。

Experimental Study on Diamond Wheel V-tip Truing Using a Tangential Grinding Truing Method

LIANG Zhiqiang, WU Lifei, ZHOU Tianfeng, ZHANG Suyan, WANG Qiuyan, JIAO Li, WANG Xibin   

  1. Key Laboratory of Fundamental Science for Advanced Machining, Beijing Institute of Technology, Beijing 100081
  • Received:2017-01-13 Revised:2017-07-24 Online:2018-02-05 Published:2018-02-05

摘要: 针对超硬模具微结构磨削过程中金刚石砂轮V形尖端几何精度难以保证以及修整困难等问题,提出碳化硅修整轮切向磨削修整方法,采用不同修整参数对树脂结合剂和金属结合剂金刚石砂轮V形尖端进行修整试验,并采用修整后的金刚石砂轮进行了微结构阵列磨削试验。结果表明:在一定的修整参数下,树脂结合剂和金属结合剂金刚石砂轮的尖端圆弧半径分别达到3.5 μm和2.0 μm;两种砂轮尖端圆弧半径随着修整轮进给速度、修整深度的增加而增大,随着金刚石砂轮转速和修整轮粒度号的增加而减小;金属结合剂金刚石砂轮修整效率较低,修整后的尖端圆弧半径较小。微结构阵列磨削结果表明,修整后的两种金刚石砂轮能够满足微结构加工,而且发现树脂结合剂金刚石砂轮加工的微结构表面质量较好,更易于实现延性域磨削。

关键词: 尖端圆弧半径, 金刚石砂轮, 切向磨削修整, 碳化硅修整轮, 微结构阵列

Abstract: In order to improve the machining quality during truing V-tip of diamond grinding wheel, a tangential grinding truing method is presented. A serial of truing experiments are conducted with the resin-bonded and metal-bonded diamond wheels, and micro grinding experiments on cemented carbide micro structure array also are carried out. Experiments results show that the radius of V-tip of resin-bonded and metal-bonded diamond wheel have been trued to 3.5 μm and 2.0 μm, respectively. The V-tip radius of trued wheel is increased as the increase of feed rate and truing depth per pass, and decreased as the increase of the diamond wheel speed and grain size number of silicon carbide (GC) wheel. Metal-bonded diamond wheel has a lower truing efficiency but a smaller radius of V-tip, compared with resin-bonded diamond wheel. Further, experimental results on micro structure array show that the cemented carbide materials are precisely ground by the trued diamond wheels, a better machining quality are obtained by using the resin-bonded wheel, and it is prone to remove the cemented carbide material in ductile mode.

Key words: diamond wheel, GC dressing wheel, micro structure array, tangential grinding truing, V-tip radius

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