Research Advance on Material Removal at Microscale towards Ultra-precision Manufacturing

doi:10.3901/JME.2023.23.229

Abstract

Abstract: Ultra-precision manufacturing has been as the competitive frontier for most of coastal countries and regions with the incremental demands for ultra-high precision surfaces and structures in the hi-tech industrializations such as ultra-large-scale integrated circuits, microelectromechanical systems, and precise optics. The essence of ultra-precision manufacturing is to fabricate ultra-high precision surface or structure through the controllable addition, migration, or removal of the microscopic materials. This study reviewed the latest advances of several types of ultra-precision manufacturing technologies such as single point diamond turning, scanning probe lithography, chemical mechanical polishing, and ultra-precision grinding, which normally remove the materials at micro-scale under contact state. After that, the effects of processing parameters, processing tools, processing environment, and physical and chemical characteristics of the processed materials themselves on the material removal at microscale were systematically summarized and the microscale removal models matched the different dominated mechanisms were reviewed. Final, the challenges that will be encountered in the future development of ultra-precision manufacturing to achieve the controlled material removal at the atomic scale were prospected.

Key words: ultra-precision manufacturing, single-point diamond turning, scanning probe lithography, chemical mechanical polishing, microscopic removal mechanism, energy dissipation model

CLC Number:

TH16

CHEN Lei, LIU Yangqin, TANG Chuan, JIANG Yilong, SHI Pengfei, QIAN Linmao. Research Advance on Material Removal at Microscale towards Ultra-precision Manufacturing[J]. Journal of Mechanical Engineering, 2023, 59(23): 229-264.

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