Journal of Mechanical Engineering ›› 2023, Vol. 59 ›› Issue (23): 186-210.doi: 10.3901/JME.2023.23.186
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LI Wenhai1, ZHANG Guangming1, YU Zun1, HAN Zhifeng1, MA Lingxuan1, PENG Zilong1, XIAO Miao2, XU Lin3,4, XI Yongming5, LAN Hongbo1
Received:
2022-10-08
Revised:
2023-06-12
Published:
2024-02-20
CLC Number:
LI Wenhai, ZHANG Guangming, YU Zun, HAN Zhifeng, MA Lingxuan, PENG Zilong, XIAO Miao, XU Lin, XI Yongming, LAN Hongbo. Research Progress and Challenges of 3D Printed Conductive Biological Scaffolds[J]. Journal of Mechanical Engineering, 2023, 59(23): 186-210.
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